Special issue/Three-dimensional molded circuit boards. Molded circuits and 3-dimensional devices in speciality plastics.

Three-Dimensional Molded Interconnect Devices (3D-MID)

Three dimensional metal pattern transfer for replica molded microstructures

We report a replica molding process for simultaneously forming a three dimensional metal pattern on the surface of molded polymer microstructures. This technique uses noncovalent surface forces to guide the transfer of thin metal films from the three dimensional features of high aspect ratio poly dimethylsiloxane micromolds to polymeric replicates. The utility of this technique has been demonst...

dimensional prediction of injection molded parts using melt pressure trace and neural network

the variations in plastic injection molding process may lead to the inconsistency of molded parts' dimensions. furthermore, due to the speed of production as well as post-shrinkage of molded parts make the control of process difficult and give inaccurate molded parts. the objective of this research is to predict the dimensions of injection molded parts on the basis of cavity pressure durin...

An Integrated Design System for Molded Interconnect Devices (3d-mid)

In this paper, MIDCAD, an integrated design system for Molded Interconnect Devices, is presented and some important techniques for the development of this design system are discussed. A series of MID-related special functions and an integrated MID product model, which are not supported by conventional MCAD und ECAD systems, were developed in MIDCAD. Based on the product model, the simulation of...

Molded transparent photopolymers and phase shift optics for fabricating three dimensional nanostructures.

This paper introduces approaches that combine micro/nanomolding, or nanoimprinting, techniques with proximity optical phase mask lithographic methods to form three dimensional (3D) nanostructures in thick, transparent layers of photopolymers. The results demonstrate three strategies of this type, where molded relief structures in these photopolymers represent (i) fine (<1 microm) features that ...